Multi-Functional ECR Nano Surface Processing Systemviewed [2783] 发布时间 :
INTRODUCTION:
Multi-Functional ECR(electron cyclotron resonance) Nano Surface Processing System consists of the microwave part, ECR plasma sputtering part, gas hose, and the vacuum part. The system can realize the preparation of thin solid films with electron and ion irradiation, and other nanosurface processing techniques including chemical vapor deposition, ion etching, electron polishing and element doping. Since the multi-functional ECR nano surface processing system owns the merits of electron/ion two irradiation modes and the precise control of substrate irradiation energy and element doping content, the system provides a path to prepare and process new nanosurface with required functions.
SPECIFICATION:
ECR Plasma source
Divergence and Mirror-confinement magnetic field distributions
Microwave power continuously adjustable
Double-sputtering system
Two sputtering target under DC magnetron sputtering discharge
Cylindrical target sputtering power: ≧1500 W
High vacuum chamber
Ultimate vacuum: 3x10-5 Pa
Substrate size: ≧2 inch substrate bias power: ≧750 W
Low vacuum chamber
Ultimate vacuum: 6x10-5 Pa
External controlling system
Magnetic field oscillation: ≦0.5 Oe
Microwave power oscillation: ≦1%
Gas flow rate accuracy: ≦1% of the meter full scale\
Main application
Film preparation with ion irradiation (0-150 ev)
Film preparation with electron irradiation (0-500 ev)
Film preparation with chemical vapor depositon
Plasma etching (0-300 eV)
Electron polishing (0-500 eV)
Element doping (N、H、O、Si、Ti、Pt et al)
High temperature annealing (25 ºC ~750 ºC)